When electronic components within electronic products overheat, leading to failures, the initial solution typically involves the use of metal heat sinks. Similarly, when electronic products encounter electromagnetic interference (EMI) that compromises signal integrity, electromagnetic shielding covers and absorbing materials are employed. However, these solutions have inherent limitations, influenced by factors such as size, thermal resistance, cost, and environmental concerns, often resulting in unsatisfactory outcomes.
Nevertheless, spurred by the rapid evolution of the electronics industry, there is a pressing demand for innovative products capable of mitigating or overcoming these drawbacks. After extensive experimentation, we have developed a tailored solution to address both heat dissipation and electromagnetic interference simultaneously. Our new composite material radiators represent a significant advancement, poised to meet diverse market requirements.